Study on Thermal Characteristics of Smart LED Driver ICs Package
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چکیده
منابع مشابه
Thermal characteristics and fabrication of silicon sub-mount based LED package
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ژورنال
عنوان ژورنال: Journal of the Korean Institute of Electrical and Electronic Material Engineers
سال: 2016
ISSN: 1226-7945
DOI: 10.4313/jkem.2016.29.2.79